Power Supply AC220V±10% 50/60HZ
Power 5.0KW(Max)，Top heater(0.8KW) Bottom heater (1.2KW), IR Preheater (2.7KW),Other(0.3KW)
PCB Size 410*370mm(Max); 10*10mm(Min)
BGA Chip Size 40*40mm(Max); 10*10mm(Min)
IR Heater Size 375*285mm
Temperature Sensor 1 pcs
Operation Method 7" HD touch screen
Control System Autonomous heating control system V1（software copyright）
Alignment System Laser dot
Vacuum Adsorption Manual
Temperature Control K-type thermocouple closed-loop control with accuracy up to ±3℃
Positioning V-groove with universal fixture
Dimensions L635*W620*H655mm
Weight 43.5KG
Warranty:
Covered Against manufacturing Defects
Used for soldering and desoldering ball grid array (BGA) components on printed circuit boards(PCBs)
